Product Overview and 2025 Market Relevance Silicon carbide (SiC) dicing and wafer thinning equipment enables high-yield, high-throughput back-end processing for power devices destined for 11–33 kV grid-tied inverters and industrial drives in Pakistan’s textile, cement, and steel sectors. Purpose-built grinders, CMP/etch tools, stealth laser or blade dicing systems, and stress-relief modules deliver precise wafer thickness … Continue reading Silicon Carbide Dicing and Wafer Thinning Equipment for Backside Metallization and High-Yield Processing