Product Overview and 2025 Market Relevance Integrated wafer cutting and thinning machines purpose-built for silicon carbide (SiC) enable precision back-end-of-line (BEOL) preparation—backgrinding, stress relief, polishing, and low-chip dicing—so wafers are ready for backside metallization, thinning-dependent device performance, and high-yield die singulation. For Pakistan’s accelerating power electronics ecosystem supplying battery energy storage system (BESS) PCS, MV … Continue reading Integrated Silicon Carbide Wafer Cutting and Thinning Machines for Backside Metallization Readiness and Low-Chip Dicing