Product Overview and 2025 Market Relevance Dedicated sintering equipment purpose-built for silicon carbide (SiC) power device packaging enables high-reliability die attach and substrate bonding using silver (Ag) sinter and pressure-assisted processes with advanced void control. For Pakistan’s textile, cement, and steel sectors—where ambient temperatures can exceed 45°C and electrical rooms are dust-prone—packaging robustness is as … Continue reading Dedicated Sintering Equipment for SiC Power Device Packaging: Ag Sinter, Pressure-Assisted Bonding, and Void Control