Product Overview and 2025 Market Relevance SiC chip-level heat spreader substrates are engineered ceramic components placed directly beneath semiconductor dies or within power module stacks to conduct and laterally spread heat, reducing thermal gradients and peak junction temperatures. Using reaction-bonded SiC (RBSiC), pressureless/solid-state sintered SiC (SSiC), or SiSiC hybrids, these substrates deliver high thermal conductivity, … Continue reading SiC Chip-Level Heat Spreader Substrates for Advanced Thermal Management and High Power Density