Product Overview and 2025 Market Relevance Reliability test platforms engineered for silicon carbide (SiC) devices combine active power cycling, thermal shock, high-temperature reverse bias (HTRB), gate stress, and electrical overstress modules with physics-of-failure analytics to predict lifetime under real operating conditions. For Pakistan’s textile, cement, and steel sectors—where ambient temperatures often exceed 45°C and dust … Continue reading Reliability Test Platforms for SiC Power Cycling and Lifetime Modeling under Thermal and Electrical Stress