Product Overview and 2025 Market Relevance Low thermal resistance ceramic substrates—primarily silicon nitride (Si3N4) and aluminum nitride (AlN) in direct-bonded copper (DBC) or active metal brazed (AMB) configurations—are the thermal and mechanical backbone of silicon carbide (SiC) power modules. They provide high thermal conductivity, robust mechanical strength, and reliable electrical insulation, enabling compact, high-efficiency inverters … Continue reading Low Thermal Resistance Ceramic Substrates (Si3N4/AlN) for SiC Module Packaging and Heat Spreader Integration