Product Overview and 2025 Market Relevance High-temperature reliability test systems purpose-built for silicon carbide (SiC) devices combine HTGB (High-Temperature Gate Bias), HTRB (High-Temperature Reverse Bias), active power cycling, and thermal shock modules, enabling comprehensive lifetime validation under realistic electrical and thermal stress. For Pakistan’s textile, cement, and steel industries—where equipment rooms frequently see 45–50°C ambient … Continue reading High-Temperature Reliability Test Systems for SiC Devices: HTGB/HTRB, Power Cycling, and Thermal Shock