Thermal Backbones for 2025: Enabling Compact, Reliable Power and RF in Pakistan’s Industrial Upgrade As Pakistan’s textile, cement, and steel sectors adopt high-frequency power electronics and RF systems, thermal performance becomes the limiting factor for reliability and size. High-thermal-conductivity silicon carbide (SiC) ceramic substrates—such as SSiC and RBSiC—deliver superior heat spreading, high stiffness, and excellent … Continue reading High-Thermal-Conductivity Silicon Carbide Ceramic Substrates for Power Module Packaging and RF Applications