Product Overview and 2025 Market Relevance High-thermal-conductivity ceramic substrates—primarily silicon nitride (Si3N4) and aluminum nitride (AlN) in direct-bonded copper (DBC) or active metal brazed (AMB) formats—are the thermal and mechanical backbone of reliable silicon carbide (SiC) power module packaging. In Pakistan’s textile, cement, steel, and emerging industrial sectors, where ambient temperatures often reach 45–50°C and … Continue reading High-Thermal-Conductivity Ceramic Substrates (Si3N4/AlN) for SiC Module Packaging with Enhanced Thermal Cycling Reliability