2025 Product Overview and Market Relevance for Pakistan Silicon carbide ceramic heat-spreader substrates—R‑SiC (reaction-bonded), SSiC (sintered), RBSiC (reaction-bonded siliconized), and SiSiC (silicon-infiltrated)—are the thermal backbone of modern power electronics. By combining high thermal conductivity, low density, excellent stiffness, and outstanding wear/erosion resistance, these ceramics move heat rapidly from SiC MOSFETs, SiC Schottky diodes, IGBT legacy … Continue reading Silicon Carbide Ceramic Heat-Spreader Substrates (R‑SiC/SSiC/RBSiC/SiSiC) for Thermal Management